业界观察

winworm

通过OEM Zeland的全波电磁场算法，Mentor加入PCB的3D EM仿真软件行列，新的功能集成在Hyperlynx中，这样Mentor也能完成从PCB物理全通道模型提取到有源电路仿真的全过程：

Mentor Graphics Enhances Signal and Power Integrity Solution with Full-Wave 3D Analysis

DESIGNCON, SANTA CLARA, CA, Feb. 2, 2010—Mentor Graphics Corporation, (NASDAQ: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced delivery of full-wave 3D electromagnetic (EM) analysis functionality addressing the needs of the industry’s most advanced designers of high-performance electronic products. These EM analysis enhancements address the advanced simulation needs of engineers designing PCBs and packages that utilize high-speed interconnect technologies such as SERDES, which operate at multi-gigabit-per-second speeds.

The new functionality is a result of Mentor Graphics’ recent acquisition of certain assets of Zeland Software Inc., which for 17 years has been a recognized leader in electromagnetic simulation. This new functionality is integrated with the Mentor Graphics HyperLynx® product suites and will analyze, in full electromagnetic detail, 3D structures such as vias, solder bumps, wirebonds, and edge connectors.

“Mentor is the only supplier to provide a full PCB systems design flow including this much-needed 3D electromagnetic solution,” stated Henry Potts, vice president and general manager of Mentor Graphics’ Systems Design Division. “It further strengthens our technology and world market share lead and provides our customers with capabilities they need to design their advanced electronics products.”

Today’s fast circuits commonly operate at speeds that require high-frequency electromagnetic effects to be accurately captured and modeled on PCBs, IC packages, and at the system level. Neglecting signal-path discontinuities often results in design failures or overall system performance degradation and forces further design iterations and delay of design closure.

EM simulation increases the model accuracy for 3D interconnect structures like vias, solder bumps, bond wires, and edge connectors. Without accurate models, power- and signal-integrity simulations cannot close the analysis gap with a high degree of confidence. The EM effects of these structures are dominating performance results in systems operating at the gigahertz (GHz) frequencies common in today’s high-speed SERDES, DDR2/DDR3, RF, and other high-frequency circuits.

These new capabilities are available immediately and add to the HyperLynx suite of fast, accurate, and easy-to-use products for signal-integrity, power-integrity, PCB thermal, EMI, and mixed signal (including analog) simulation. For more information on the new full-wave 3D analysis, go to www.mentor.com/go/hyperlynx3d and register for an educational webinar to be held March 10, 2010.

winworm

SI大师Eric Bogatin即将来到中国开讲，时间：3月17日，地点：上海

http://www.pcbdesign007china.com/workshopreg.htm

概括
今天的PCB设计师和工程师必须面对两方面的压力，一方面数据速率在不断提高，另一方面开发的预算和时间却在不断被挤压。频率越高的设计中，偷工减料可能意味着代价高昂的返工，以及错过交货日期。

在信号完整性高速设计研讨会上，我们的导师Eric Bogatin将解释高速PCB设计原则和信号完整性问题。与会者将通过真实例子来学习PCB设计技术是如何影响信号完整性的，以及你所需要知道关于特性阻抗，差分阻抗，串扰和高速串连的一些东西。

与会者将获得深入的知识包括：
•地平面反弹噪声
•反射
•带宽
•差分对
•去耦电容
•经验法则 - 哪些是至关重要的？

信号完整性高速设计将会提供给您最新有关高速PCB设计的信息

哪些人需要参加
想要深入了解高速设计技术和信号完整性问题的PCB设计师和工程师们。

关于我们的讲师
Eric Bogatin博士——被业界誉为“信号完整性的传道者”。他是一名著名的信号完整性专家和经验丰富的培训师。他在麻省理工学院获得物理学硕士，随后在亚 利桑那大学获得博士学位。Bogatin博士在获得Interconnect Devices, Inc实验室的CTO职务之前，还供职于许多微电子公司，包括AT＆T贝尔实验室，Raychem公司和Sun微系统公司。他在世界各地举办的会议和研讨 会上教授关于信号完整性的课程。他是Signal Integrity: Simplified的作者，同时他还著有上百篇关于信号完整性和互联设计的技术文章。Bogatin博士是PCBDesign007和 PCB007DesignChina的专栏作家与编辑。

winworm

Hspcie 2010.03发布，增加对ibis 5.0的支持：

Signal Integrity
■ IBIS 5.0 — AMI support in Statistical Eye Diagram (.StatEye)—HSPICE
includes the standalone amicheck utility that enables StatEye analysis of
systems with SERDES devices for equalizers in both transmitter (TX) and
receiver (RX) sides.

mars

请教版主Winworm，请评价一下IBIS-AMI，能否成为主要的high speed serial link的仿真标准？对spice如何？

winworm

目前来看，ibis-ami是最好的高速串行通道仿真模型，同时兼有stateye的速度spice的精度，当然最关键的一点是芯片厂商必须提供，如没有模型就是无米之炊，现在已经有ibm、xilinx提供ami模型。用过加密hspice模型的人都知道，速度很慢，尤其是最近altera s4的高速串行收发器模型，32bit下竟然跑不了，需要切换到64bit linux下可以跑，当然行为级的verilog-a倒是可以跑，但是与hspice的版本要匹配。

winworm

Ansys正在慢慢去除Ansoft的痕迹，一个微妙的变化：5.0是Ansoft LLC，到5.02的时候已经变成ANSYS，Inc


             Ansoft Designer and Nexxim 5.0 (tm) Readme.txt
                         WINDOWS Release
                  ----------------------------------
                           Ansoft LLC   
             225 West Station Square Drive, Suite 200
                   Pittsburgh, PA USA 15219-1119


           Ansoft Designer and Nexxim 5.0.2 (tm) Readme.txt
                         WINDOWS Release
                  ----------------------------------
                           ANSYS, Inc.
             225 West Station Square Drive, Suite 200
                   Pittsburgh, PA USA 15219-1119

qjjgx1

收益了，感谢winworm!

jerryaaa

请教版主Winworm，请评价一下Sigrity 9.1，它的SI和PI如何？与Ansoft 的解决方案有何优略，一直想问这个问题，谢谢！

Flounce

应该是很好的技术贴，可惜我不是这一块的

winworm

请教版主Winworm，请评价一下Sigrity 9.1，它的SI和PI如何？与Ansoft 的解决方案有何优略，一直想问这个问题 ...
jerryaaa 发表于 2010-4-17 17:55

简单说一下吧：

Sigrity主要集中在PI，更确切的说是Package的PI，当然随着时间的推移，后来板级PI也成Sigrity的重点，再后来通过引入Kumer，增加了Channel Sim。Ansoft的PI就是Siwave的解决方案，SI则是Designer+Nexxim，至于HFSS、Q3D都是提模工具。

从SI上来说，Designer+Nexxim对于Sigrity是没有对应产品的，也就是Ansoft有系统级的解决方案，而Sigrity缺失，只有一个支持AMI模型的通道仿真模块，但是单单就AMI来说，Sigrity是目前能得到的2个最好AMI引擎之一，另外一个是Sisoft，Ansoft目前对AMI的支持并不好。

从PI上来说，Sigrity是PI的鼻祖，无论从软件的成熟度、准确度，还是易用性、可用性上面都优于Siwave。没错，Siwave支持的功能并不少，但是用起来就是没有Sigrity方便，而且还不能直接得到温升，需要在icepak中做。