IPC-ML-960 Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards 多层电路板用预制内层在制板的鉴定与性能规范 25页 IPC-1065 Material Declaration Handbook (For Users and Manufacturers of Printed Circuit Boards ) 72页 IPC-1066 Marking , Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies , Components and Devices 20页 IPC-1131 Information Technology（IT）Guide for PWB Manufacturers 印制板制造商用信息技术导则 20页 IPC-1902 Grid Systems for Printed Circuits 印制电路网格体系 8页 IPC-2221A Generic Standard on Printed Board Design 印制板设计通用标准 124页 (已出版中文版) IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards 刚性有机印制板设计分标准 38页 (已出版中文版) IPC-2223A Sectional Design Standard for Flexible Printed Boards 挠性印制板设计分标准 36页 IPC-2224 Sectional Standard for Dsign of PWBs for PC Cards PC卡用印制电路板设计分标准 30页 IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 有机多芯片模块(MCM-L)极其组装件设计分标准 32页 IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuits 100页 IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) and Microvias 高密度互连(HDI)与微导通孔设计导则 40页 IPC-2511A Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology 产品制造数据及其传输方法学的通用要求 159页 IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系 19页 IPC-2547 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test,Inspection and Rework 56页 IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Descripition Data and Transfer Methodology 166页 IPC-2615 Printed Board Dimentions and Tolerances 印制板尺寸和公差 76页 IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives 表面贴装导电胶使用指南 23页 IPC-3408 General Requirements for Anisotropically Conductive Adhesive Films 各向异性导电胶膜的一般要求 21页 IPC-4101B Specification for Base Materials for Rigid and Multilayer Printed Boards 刚性及多层印制板用基材规范 109页 IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范 52页 IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials 高密度互连（ＨＤＩ）及微导通孔材料规范 58页 IPC-4110 Specification and Characterization Methods for Nonwaven Cellulose Based Paper For Printed Boards 印制板用纤维纸规范及性能确定方法 23页 IPC-4121 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则 20页 IPC-4130 Specification and Characterization Methods for Nonwaven “E” Glass Mat 玻璃非织布规范及性能确定方法 23页 IPC-4411A Specification and characterization Methods for Nonwoven Para-Aramid Reinforcement 聚芳基酰胺非织布规范及性能确定方法 32页 IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards 印制板化学镍/浸金镀层规范 40页 IPC-4562 Metal Foil for Printed Wiring Applications 印制线路用金属箔 36页 IPC-5701 Users Guide for Cleanliness of Unpopulated Printed boards 未组装印制板清洁用户指南 12页 IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范 23页 (已出版中文版) IPC-6012B Qulification and Performance Specification for Rigid Printed Boards刚性印制板的鉴定与性能规范 56页 (已出版中文版) IPC-6013A Qualification and Performance Specification for Flexible Printed Boards 挠性印制板的鉴定与性能规范 44页 (已出版中文版) IPC-6015 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Intercnnecting Structures 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 30页 IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Board 高密度互连（HDI）层或印制板的鉴定与性能规范 28页 IPC-6018 Microwave End Product Board Inspection and Test 微波成品印制板的检验和测试 35页 IPC/JPCA-6202 Performance Guide Manual for Single and Double-sided Flexible Printed Wiring Boards 单双面挠性印制板性能手册 107页 (已出版中文版) IPC/JPCA-6801 Terms and Definitions, Test Methods, and Design Examples for Build-up High Density Interconnect (HDI) Printed Wiring Boards 积层/高密度互连的术语和定义、试验方法与设计例 41页 (已出版中文版) IPC-7095A Design and Assembly Process Implementation for BGAs 球珊阵列的设计与组装过程的实施 128页 IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard 92页 IPC-7525 Stencil Design Guidelines 网版设计导则 IPC-7711 Rework of Electronic Assemblies 电子组装件的返工 193页 IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies 印制板与电子组装件的修复与修正 176页 IPC-7912 Calculation of DPMO and Manufacturing Indices for Printed Board Assemblies 印制板和电子组装件的DPMO（每百万件缺陷数）和制造指数的计算 20页 IPC-9151 Printed Board Process Capability,Quality,and Relative Reliability(PCQRR) Benchmark Test Standard and Database 23页 IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计过程控制（SPC）的通用导则 52页 IPC-9194 Implementation of Statistical Process Control (SPC) Applied to printed Board Assembly Manufacture Guideline 36页 IPC-9201 Surface Insulation Resistance Handbook 表面绝缘电阻手册 71页 IPC-9261 In-Process DPMO and Estimated Yield for PWAs （印制板制造过程中DPMO（每百万件缺陷数）和产量评估） 24页 IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components （Preconditioning IC components） 电子元件的印制板组装过程模拟评价（集成电路预处理） 24页 IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components 电子元件的印制板组装焊接过程导则 23页 IPC-9503 Moisture Sensitivity Classification for Non-IC Components 非集成电路元件的湿度敏感度分级 19页 IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成电路元件的组装过程模拟评价（非集成电路元件预处理） 26页 IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects 28页 IPC-9850 Surface Mount Placement Equipment Characterization 69页
IPC-HDBK-001 Handbook and Guide to the Requirement for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B 已焊接电子组装件的要求手册与导则 135页
J-STD-001D Requirements for Soldered Electrical & Electronic Assemblies 电气与电子组装件锡焊要求 69页 J-STD-002B Solderability Tests for Component Leads,Terminations,Lugs,Terminals and Wires 元件引线、端子、焊片、接线柱及导线可焊性试验 40页 J-STD-003A Solderability Test for Printed Boards 印制板可焊性试验 30页 J-STD-004A Requirements for Soldering Fluxes锡焊焊剂要求 20页 J-STD-005 Requirements for Soldering Pastes 焊膏技术要求 31页 J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for electronic Soldering Applications 28页 J-STD-012 Implementation of flip chip and chip scale technology 倒装芯片及芯片级封装技术的应用 120页 J-STD-013 Implementation of Ball Grid Array & Other High Density Technology 球栅阵列(BGA)及其它高密度封装技术的应用(1996-07) 103页 J-STD-020C Moisture/Reflow Sensitivity classification for Non-Hermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度/再流焊敏感度分类 18页 J-STD-026 Semiconductor Design Standard for Flip Chip Applications 倒装芯片用印制板设计标准 48页 J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations 20页 J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片凸块结构的性能标准 36页 J-STD-032 Performance Standard for Ball Grid Array Balls 球珊阵列性能标准 17页 J-STD-033A Standard for Handling Packing Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表贴装器件的处置、包装、发运和使用 20页 J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜(1999-04) 20页 IPC-T-50G Terms and Definitions for Interconnecting and Packaging Electronic Circuits 电子电路互连与封装术语与定义 111页 IPC-SC-60A Post Solder Solvent Cleaning Handbook 锡焊后溶剂清洗手册 48页 IPC-SA-61 Post Solder Semiqueous Cleaning Handbook 锡焊后半水溶剂清洗手册 32页 IPC-AC-62A Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册 49页 IPC-CH-65A Guideline for cleaning of Printed Boards and Assemblies 印制板及组装件清洗导则 56页
作者: waft 发布日期: 2006-6-08
IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验 25页 IPC-SG-141 Specification for Finished Fabric Woven From “S”Glass for Printed Boards 印制板用经处理S玻璃纤维织物规范 20页 IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed boards 印制板用经处理聚芳酰胺纤维编织物规范 17页 IPC-QF-143 Specification for Finished Fabric Woven from Quartz （Pure Fused Silica）for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范 20页 IPC-CF-148A Resin Coated Metal Foil for Printed Boards 印制板用涂树脂金属箔 27页 IPC-CF-152B Composite Metallic Material Specification for Printed Wiring Boards 印制线路板复合金属材料规范 33页 IPC-FC-234 PSA Assembly Guilelines for Single-Sided and Double-Sided Flexible Printed Circuits 单面和双面挠性印制电路压敏胶粘剂组装导则 31页 IPC-FA-251 Assembly Guidelines for Single-Sided and Double-Sided Flexible Printed Circuits 单面和双面挠性电路组装导则 44页 IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 高可靠表面安装技术印制板组装件设计导则 146页 IPC-A-311 Process controls for phototool Generation and Use 照相版制作和使用的过程控制 18页 IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques 采用高速技术电子封装设计导则 83页 IPC-D-322 Guidelines for Selecting Printed Wiring Board Size Using Standard Panel Sizes 使用标准在制板尺寸的印制板尺寸选择指南 14页 IPC-D-325A Documentation Requirements for Printed Boards，Assemblies and support Drawings 印制板、印制板组装件及其附图的文件要求 94页 IPC-D-326 Information Requirements for Manufacturing Printed Board Assemblies 制造印制板组装件的资料要求 16页 IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers 钻床和铣床用计算机数字控制格式 16页 IPC-D-356B Bare Substrate Electrical Test Data Format 裸基板电检测的数据格式 72页 IPC-C-406 Design and Application Guidelines for Surface Mount Connectors 表面安装连接器设计及应用导则 48页 IPC-CI-408 Solderless Surface Mount Connector Design characteristics and Application Guidelines 无焊接表面安装连接器设计及应用导则 46页 IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Board 封入式分立布线互连板通用规范 43页 IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards（includes amendment 1） 印制板分立线路的设计及成品要求（包括修改1） 53页 IPC-DW-426 Specifications for Assembly of Discrete Wiring 分立线路组装规范 31页 IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes 21页 IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 126页 IPC-DR-570A General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards 钻柄直径1/8英寸的印制板用硬质合金钻头通用规范 17页 IPC-TR-578 LEADING EDGE MANUFACTURING TECHNOLOGY REPORT 100页 IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated-Through Holes in Printed Wiring Boards 印制板中小直径镀覆孔可靠性评价联合试验 90页 IPC-WP/TR-584 IPC White Paper and Technical Report on Halogen-Free Materials Used for Printed Circuit Boards and Assemblies 40页 IPC-A-600G Acceptability of Printed Boards 印制板验收条件(2004-07) 140页 (已出版中文版) IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量评价手册 55页 IPC-HDBK-610 Handbook and Guide to IPC-A-610 （Includes IPC-A-610B to C Comparison） IPC-A-610手册及导则（包括IPC-A-610B 与 C的比较） 124页 IPC-A-610D Acceptability of Electronic Assemblies 印制板组装件验收条件(2005-02) 404页 IPC-OI-645 Standard for Visual Optional Inspection Aids 目视光学检查工具标准 51页 IPC-TM-650 Test Methods 测试方法 861页 IPC-QL-653A Certification of Facilities that Inspect/Test Printed Board, Components and Materials 印制板、元器件及材料检验试验设备的认证 29页 IPC-MI-660 Guidelines for Incoming Inspection of Printed Board Materials 144页 IPC-PE-740 Troubleshooting for Printed Board Manufacture and Assembly 印制板制造和组装的故障排除 391页 IPC-CM-770E Guidelines for Printed Board Component Mounting 印制板元件安装导则 164页 IPC-SM-780 Component Packaging and Interconnecting With Emphasis on Surface Mounting 以表面安装为主的元件封装及互连导则 168页 IPC-SM-782A Surface Mount Design and Land Pattern Standard（includes Amendment 1 and Amendment 2） 表面安装设计及连接盘图形标准（包括修订1和2） 228页 IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation 芯片直装技术实施导则 53页 IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachment 表面安装焊接件加速可靠性实验导则 58页 IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive Ics 湿度/再流焊敏感集成电路的特性分级与处置程序 42页 IPC-MC-790 Guidelines for Multichip Module Technology Utilization 多芯片组件技术应用导则(1992-08) IPC-S-816 SMT Process Guideline and Checklist 表面安装技术过程导则及检核表 46页 IPC-CA-821 Genaral Requirements for thermally Conductive Adhesives 导热胶粘剂通用要求 17页 IPC-HDBK-830 Guidelines for Design, Selection, Application of Conformal Coatings 印制板组装件用电绝缘复合材料的鉴定与性能 102页 IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Board Assemblies（with amendment 1）印制板组装件用电绝缘复合材料的鉴定与性能（包括修改1） 28页 IPC-SM-839 Pre and Post Solder Mask Application Cleaning Guidelines 阻焊施加前及施加后清洗导则 25页 IPC-SM-840C Qualification and Performance of Permanent Solder Mask 永久性阻焊的鉴定和性能 32页 (有中文版) IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits 厚膜多层混合电路设计标准 88页 IPC-HM-860 Specification for multilayer Hybrid Circuits 多层混合电路规范 35页 IPC-TF-870 Qualification and performance of Polymer Thick Film Printed Boards 聚合物厚膜印制板的鉴定和性能 30页 IPC-ML-960 Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards 多层电路板用预制内层在制板的鉴定与性能规范 25页 IPC-1065 Material Declaration Handbook (For Users and Manufacturers of Printed Circuit Boards ) 72页 IPC-1066 Marking , Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies , Components and Devices 20页 IPC-1131 Information Technology（IT）Guide for PWB Manufacturers 印制板制造商用信息技术导则 20页 IPC-1902 Grid Systems for Printed Circuits 印制电路网格体系 8页 IPC-2221A Generic Standard on Printed Board Design 印制板设计通用标准 124页 (已出版中文版) IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards 刚性有机印制板设计分标准 38页 (已出版中文版) IPC-2223A Sectional Design Standard for Flexible Printed Boards 挠性印制板设计分标准 36页 IPC-2224 Sectional Standard for Dsign of PWBs for PC Cards PC卡用印制电路板设计分标准 30页 IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 有机多芯片模块(MCM-L)极其组装件设计分标准 32页 IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuits 100页 IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) and Microvias 高密度互连(HDI)与微导通孔设计导则 40页
IPC-2511A Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology 产品制造数据及其传输方法学的通用要求 159页 IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系 19页 IPC-2547 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test,Inspection and Rework 56页 IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Descripition Data and Transfer Methodology 166页 IPC-2615 Printed Board Dimentions and Tolerances 印制板尺寸和公差 76页 IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives 表面贴装导电胶使用指南 23页 IPC-3408 General Requirements for Anisotropically Conductive Adhesive Films 各向异性导电胶膜的一般要求 21页 IPC-4101B Specification for Base Materials for Rigid and Multilayer Printed Boards 刚性及多层印制板用基材规范 109页 IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范 52页 IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials 高密度互连（ＨＤＩ）及微导通孔材料规范 58页 IPC-4110 Specification and Characterization Methods for Nonwaven Cellulose Based Paper For Printed Boards 印制板用纤维纸规范及性能确定方法 23页 IPC-4121 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则 20页 IPC-4130 Specification and Characterization Methods for Nonwaven “E” Glass Mat 玻璃非织布规范及性能确定方法 23页 IPC-4411A Specification and characterization Methods for Nonwoven Para-Aramid Reinforcement 聚芳基酰胺非织布规范及性能确定方法 32页 IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards 印制板化学镍/浸金镀层规范 40页 IPC-4562 Metal Foil for Printed Wiring Applications 印制线路用金属箔 36页 IPC-5701 Users Guide for Cleanliness of Unpopulated Printed boards 未组装印制板清洁用户指南 12页 IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范 23页 (已出版中文版)
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发表于 2006-7-22 16:52:00
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