业界观察

ding3211

IBM最近不是要收购SUN了吗？

winworm

Mentor终于发布Hyperlynx SI/PI 8.0:

Mentor Graphics released 200903075 HyperLynx SI/PI HLSI/PI8.0 on Apr 10, 2009.

Advanced SERDES CoSim Op SW    New
HyperLynx PI DC Drop Ap SW    New
HyperLynx PI Decoupling Ap SW    New
HyperLynx PI Power Bnd SW    New
HyperLynx SI BSim EXT Ap SW    New
HyperLynx SI BSim GHz Ap SW    New
HyperLynx SI DDRx Ap SW    New
HyperLynx SI EXT Bnd SW    New
HyperLynx SI GHz Bnd SW    New
HyperLynx SI LSim EXT Ap SW    New
HyperLynx SI LSim GHz Ap SW    New
HyperLynx SI PI Bnd SW    New
S Parameter Extraction Op SW    New

pcbfpchit

好东东，多多宜善

pcbfpchit

[em10]

winworm

甲骨文收购Sun 今年夏天完成交易

甲骨文以现金收购Sun微系统公司,交易价格达74亿美元。该协议达成后，IBM公司放弃了收购网络设备制造商。IBM公司此前表示愿意以每股9.40美元购买Sun公司的股票，但收购谈判破裂后，IBM公司于本月初取消独家谈判权，IBM并撤回其报价。

甲骨文Oracle预期购买在交易关闭之后的第一年每股增加至少15 美分的所得。该交易已被Sun公司的董事会通过，甲骨文公司预计将在今年夏天完成此次的交易。

http://www.sun.com/aboutsun/media/presskits/2009-0420/index.jsp

Sun的硬件部门将何去何从？Istvan Novak也在Silist上正式公布了自己的网站，一个好消息是这次的网站没有撞墙，而上att的网站是需要翻墙的。

Date: Mon, 20 Apr 2009 09:00:50 -0400
From: Istvan Novak <istvan.novak@att.net>
Subject: [SI-LIST] Electrical Integrity website is up and running

Dear list members,

As you may recall from an earlier posting from last Fall, for the tenth
anniversary of creating the http://home.att.net/~istvan.novak/ website,
it moved to a new place.  Thanks for all of those list members who
came forward with suggestions and feedback.

The http://www.electrical-integrity.com/ website is now up and
running with a lot of added contents. More than a dozen items were
added to the Paper download page, both new, and some very old,
based on the frequency of off-line requests to those items.

The Tool download section has two new illustration pieces, both
may be relevant to recent discussions on the frequency variations
of dielectric loss and characteristic impedance.

The Links page has also been updated and expanded with new items.

The new Book reviews page will soon be the home of my personal
views on books in signal and power integrity.  The first in the making
is on Resso-Bogatin: Signal Integrity Characterization Techniques.
The next in line may be Hall-Heck: Advanced Signal Integrity for
High-Speed Digital Designs

All of the above pages are free and require no registration.  The
last page, Class participants, is reserved for the participants of my
signal integrity and power integrity classes. For a list of scheduled
classes please look at the websites of the organizers, listed with links
on the bottom of the opening page.

As always, if you have feedback or questions, feel free to send a
mail.

Regards,

Istvan

winworm

力恺发布SIMDE，我一直在等待S2ibis的升级，看来现在是没戏了，因为维护、升级S2ibis一定是免费的，而SIMDE则可以卖钱！



SIMDETM V1.0 简介

仿真在高速系统设计中起着越来越大的作用。它可以帮助您优化设计性能，缩短设计周期，降低样机成本和投入到市场的周期。电气（电子）建模是进行芯片和系统仿真的起点。

信号完整性模型开发环境（SIMDE™）提供了图形化模型开发和验证环境，为模型开发和验证提供直观的方法。它着重于SI模型自动生成和验证过程（本版本中的IBIS和SPICE宏模型，以后升级版本中的Verilog-A / VHDL-AMS）。


SIMDE ™帮助您提高建模性能和精度。

IBIS模型生成与验证

SIMDE™提供了一个自动化的IBIS缓冲器模型生成和验证过程。它提供了一个图形界面，对应SPICE缓冲器节点以及使用原理图编辑模式设置其它节点。

在整个过程中不需要任何手工编辑。它会自动运行Synopsis HSpice，从Spice缓冲器中提取缓冲行为。

SIMDE™ 有生成IBIS缓冲器模型的无缝验证流程。在生成IBIS缓冲器并利用IBIS缓冲器在您自己的拓扑结构上进行IBIS模型验证时，SIMDE™会自动记忆Spice模型的设置。它还提供了Spice、IBIS仿真的波形查看的详细DPI（差异峰值指数）和DAI（差异平均指数）。


它包括：
►自动对应Spice缓冲器节点的功能；
►图形界面节点设置功能；
►从Spice中自动提取IBIS缓冲器；
►驱动和接受模式下的补偿电容提取功能；
►提供所有IBIS输入/输出/双向模型类型和差分缓冲器（伪差分对、半差分对和全差分对缓冲器）的提取功能；
►IBIS缓冲模型验证区域，可自由设置拓扑；
►详细的验证报告，包含DPI（差异峰值指数）和DAI（差异平均指数）；
►波形查看IBIS缓冲曲线和ODT、非单调性和负载线验证报告（SignalMeth™ IBIS 应用模块）


Spice宏模型生成、拟合和验证

SIMDE™提供了Spice宏模型生成、拟合和验证的综合流程。它允许用户从零开始或从基本元件开始，使用我们集成的标准库元件或您自己设计的黑盒元件。

拟合流程中可以加载标准波形（Golden waveform）以便进行宏模型的优化。它可以扫描多个参数并找出最符合标准波形（Golden waveform）的参数。

验证流程提供了一个简易验证宏模型的环境，宏模型可以是您自己创建的，也可以加载其它模型来进行特定的验证。

它几乎可以创建任何您需要的模型。我们提供以下特定模型的教程：


• 预加重驱动器
• SSO 驱动器
• SSO 驱动器 (IBIS BIRD 95 type)
• SSO 驱动器(IBIS BIRD 98 type)
• SSO 接收器

wjdai_11

感谢winworm带来业界最新的动态！

winworm

Introducing IE3D-SI

·   IE3D-SI targets circuit designers and signal integrity engineering teams developing advanced packages, PCBs, ICs, and MMICs.

·  The entire “layout-to-EM model” flow is fully automatic featuring 1-Click native integration from Cadence Allegro® PCB/ Package Designer, AWR Microwave Office®, Autocad DXF and GDSII layout databases.

·  Automatic 3D geometry model creation features full support for TRUE dimension for  , bond wires, solder balls & bumps, interconnect and dielectric thicknesses.  Proprietary non-uniform mesh generation and adaptive Intelli-Fit curve fitting ensure fast and accurate simulation results for these broadband applications.
    

·  Built-in mixed domain SPICE simulation performs robust, accurate, and efficient time-domain simulation based up frequency domain s-parameter models.  Great for simulation of transient and time-harmonic analysis of interconnect-like passive structures.  Includes broadband SPICE model extraction, stimulus and signal spectrum analysis, transmission line delay analysis, and random/jitter-enabled clock signal analysis with eye-diagram display.
    
    

Full Package, PCB and Circuit Solution

Today’s high-frequency IC, MMIC, package and PCB designs need full-wave EM-accurate circuit models to confidently converge on a final physical implementation that will satisfy your target performance requirements.  IE3D-SI is the industry’s first full-wave 3D EM design and verification solution proven to meet the capacity & run-time performance demands of complete package, PCB or circuit-level simulation and modeling.  The results are EM-accurate enabling design and SI engineers to design and verify even their largest designs with the highest level of confidence.

High Capacity

Using other commercial EM tools forces engineers to over-simplify and/or reduce the size of the structure to be simulated.  In many cases, layer stack-ups, and adjacent metal structures must be trimmed away before the tool can attempt to complete the simulation.  As a result, the engineer gives up too much accuracy with these approaches and proves to be too limiting, very time-consuming, and totally inadequate towards capturing all the important parasitic coupling and electrical characteristics of the complete structure.  Unfortunately,  the designer is left with a poor choice to widen design margins which leads to  under achieving system performance goals and requiring more area or I/Os than necessary.  

Automatic 3D Geometry Modeling & Meshing

One of the biggest challenges accompanying very large EM structure simulation, is the ability for the user to quickly and accurately build a full 3D geometry model.  Secondly, generating an EM mesh for such a structure that fits into a compact computer memory footprint and will not overwhelm the underlying EM engine has long been a unbroken design barrier.  IE3D-SI is the first industrial solution that has successfully shattered this design barrier with native integration to a variety of popular layout design tools.
    
    

Full 3D geometry models of bond wires, solder balls, bumps, vias, interconnect and dielectric layers are automatically extracted directly from the layout data and meshed to ensure proper handling by the IE3D-SI EM engine.  Now, design and signal integrity engineers are granted easy access to an accurate EM solution to improve and verify a design’s final performance as part of their overall EM design practice.
    
    

EM Modeling & Mixed-Domain Spice Simulation

IE3D-SI delivers multiport s-parameter models (Touchstone Format) and broadband RCLK Spice sub circuit models ready to be plugged into your circuit simulations.  IE3D-SI  also comes equipped with MDSPICE, a mixed frequency and time domain SPICE simulator featuring a combined time-domain and frequency-domain simulation engine. MDSPICE performs robust, accurate, and efficient time-domain simulations based upon frequency-domain s-parameters.  MDSPICE  accepts any combination of  s-, y- or z-parameter files as elements or RLC sub circuit netlists.

 It is well known that s-parameter frequency responses are an accurate and complete description of circuit performance. It is well known extracting RLC netlists from s-parameter models is an optimization process that suffers accuracy loss over broad frequency range.  Such extraction methods attempt to match frequency responses of the extracted RLC netlist to that of the target s-parameter file.  Structures with many ports further limit this approach.  MDSPICE does not have such frequency limitations and performs efficient transient analysis of complex multiport EM structures without loss of accuracy.

winworm

Ansoft Tools Couple With ANSYS For Real-World Simulation

Separate Physics Brought Together In Complex Electronic Design Application; Next Important Milestone in Simulation Driven Product Development(TM)
SOUTHPOINTE, Pa., May 04, 2009 (BUSINESS WIRE) -- ANSYS, Inc. (NASDAQ: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced a first milestone in coupling ANSYS(R) and Ansoft(TM) products, successfully performing multiphysics simulations that involve electromagnetic applications. As electronics become more embedded into automotive, aerospace, industrial and consumer products, engineers must consider factors such as circuitry's ability to withstand vibration shocks, heat generation and electromagnetic interference. The combined depth and breadth of solutions from ANSYS is key to solving problems that involve these complex systems. In performing several case studies, ANSYS engineers deployed the electromagnetic effects determined by Ansoft software directly in ANSYS thermal and structural simulation. Work is ongoing to fully integrate Ansoft software directly into the ANSYS(R) Workbench(TM) platform for future bidirectional and seamless operation.

For example, a high-power electronic connector used in a military radar application to connect a transmitter to an antenna must be engineered from electromagnetic, thermal and structural perspectives to ensure success. The simulation was performed by coupling Ansoft's HFSS(TM) software with the ANSYS Workbench environment, using advanced thermal and structural capabilities. Engineers used HFSS to ensure that the device was transmitting in the proper path, by calculating the high-frequency electromagnetic fields, power loss density distribution and S-parameters. In such high-power applications, it is critical to determine the temperature distribution to ensure the device stays below temperatures that cause material failure, such as melting. The power loss density results from the HFSS simulation were used as the source for the thermal simulation performed within ANSYS(R) Mechanical(TM) software, which simulated the temperature distribution of the device.

"Such coupling will allow engineers to integrate complex electronic designs at component, circuit and system levels, upfront in the design cycle, where changes can be incorporated quicker and more cost effectively. This is just the first step. We're now working to directly couple the Ansoft products with the rest of the ANSYS suite," said Zol Cendes, chief technology officer and general manager at Ansoft. "The full integration of ANSYS mechanical/thermal/fluid tools with world-class Ansoft electronic design automation software -- directly coupled for interactive use within the ANSYS Workbench environment -- will allow users to perform closely coupled multiphysics simulations. We believe this integration process is critical to enabling the transition to a mechatronic design methodology that allows customers to view design problems in a new and improved paradigm. This technology will allow organizations to develop leading-edge products that can withstand rigorous usage in the real world."

In another case, a valve-actuating solenoid application used a coupled ANSYS and Ansoft simulation to analyze temperature distribution. Solenoids are commonly found in automotive starter systems, home appliances, industrial air hammers and other devices that rely on a sudden burst of power to move a specific part. Maxwell(R) software was used to calculate the power loss from the low-frequency electromagnetic fields within the solenoid. The power loss was used as an input for a thermal simulation performed with ANSYS Mechanical software to determine the temperature profile of the device. Subsequently, the application predicted how the device deformed due to the rise in temperature. Such coupling delivers a powerful analysis framework needed to solve these complex, interrelated physics problems. Thus, engineers soon will be able to address electro-thermal-stress problems associated with optimizing state-of-the-art radio frequency (RF) and electromechanical components including antennas, actuators, power converters and printed circuit boards (PCBs).

The coupling of ANSYS and Ansoft tools also will provide users with a significantly broader simulation environment. "Take, for example, a wind power application," continued Cendes. "ANSYS has excelled in helping companies optimize blade design, in terms of structural integrity of the blade, with mechanical software. Our tools also help ensure that the design efficiently captures the kinetic energy from the wind, using ANSYS fluid flow products. With the addition of the Ansoft technology, we can expand our solution to help users design the electric generators that convert the wind's kinetic energy into electrical energy. We also can help design the power conversion, transmission and electronic control that transform the electrical energy into a usable form to deliver it to the electrical power grid. The ultimate benefit is that users can rely on ANSYS as a single source for world-class design software, technical support and services for the design of complete systems. The ANSYS breadth of engineering solutions and depth of multiphysics technologies gives customers the tools they need to succeed in today's ultra-competitive environment."

winworm

2009年CST100%兼并Simlab公司

2009年4月16日，在德国达姆斯塔特市CST总部，计算机仿真技术股份有限公司（简称CST）正式宣布SimLab软件有限责任公司已成为CST 股份有限公司全资子公司。继2007年6月两公司成功签署参股合股协议之后，CST收购了Simlab全部已发行股票。

 

专注于PCB（印刷电路板）和电缆束仿真的设计工程师们将得益于这次收购后双方产品开发与支持的全面协同开拓。这次收购将促进SimLab的刀片技术与CST设计环境的融合。

 

基于SimLab技术的两大产品早已成功整合在CST STUDIO SUITE™（CST工作室套装），即CST PCB STUDIO™ (CST PCBS) 和 CST CABLE STUDIO™ (CST CS)，研究PCB板上的信号传播和高效能电缆束。

 

CST PCB STUDIO

 

CST PCBS用于研究信号和电源的完整性，电路印刷板(PCB)上的EMI电磁干扰影响和EMC电磁兼容仿真，以及涉及高速数字、模拟或混合信号的应用和电源应用。CST PCBS将不同的设计流程整合在一起，计算寄生串音影响和仿真频域或者时域内的电子网络。最值得称道的是它与CST微波工作室的接口可以把PCB仿真与电磁辐射连续完整的3D分析结合起来。

 

CST CABLE STUDIO

CST CS用于分析电缆束系统的SI(信号完整性)，EMC(电磁兼容)和EMI(电磁干扰)影响，包括当电缆数量不受限制极其繁杂时，CST CS用于优化单线，双绞线和混合电缆束的屏蔽，重量和占用空间；当然也包括传统运用的分析，如针尖电压分布，穿过元器件的电流，散射参数，阻抗和通过CST MWS  的辐射仿真。

 

CST管理总监贝纳德.瓦格纳博士评价此次收购：这次收购标志着EMC/信号完整性分析工具不断增长的市场需求。SimLab在EMC领域大量的技术秘诀已证明是无价的，它加强了CST在3D EM仿真市场的专业水准。我们的客户也将得益于这些市场上独一无二技术的完美组合。