业界观察

winworm

Ansoft发布HFSS 11.2,首次提供与Ansys V12的接口进行机械分析和热分析：

Version 11.2 Enhancements
=============================================
HFSS is now able to export surface and volume losses in .xml file format for linking to
an ANSYS Mechanical v12 thermal analysis.

DXF files can now be imported with .tech layer mapping files.


同时更新的还有Designer 4.1，Nexxim 4.1：

MAJOR ENHANCEMENTS Designer V4.1
--------------------------------

 - General:
    o New S Parameter Analyzer tool
       - reorder matrix
       - renormalize matrix
       - adjust termination impedance
       - de-embed ports (if gamma is defined)
       - check passivity
       - look at statistics of data
       - color coded data tables and XY plots
       - color coded matrix display in multiple formats
       - compare two S matrices
    o New I/O Wizard to setup channels and IBIS buffers
       - rapid setup of IBIS drivers for large pin counts
       - ability to group individual items into sub-circuits
       - support parameterization of all component parameters (sources, power)
       - produces a fully functional final schematic
    o New option to only look at presolved data while tuning
    o New event callbacks that run before, during or after simulation
    o Bypass option for solver-on-demand models
    o Improved tuning speed by prevent engine reloading
    o Speed improvements in parameteric model data reading and writing
    o User can define different locations for syslib and userlib  
    o Nexxim - DSO support for parametric sweeps
 - Dynamic links to Ansoft products:
    o Push excitations for QuickEye
   
   
MAJOR ENHANCEMENTS Nexxim V4.1
--------------------------------
 
 - General:
    o Support for remote analysis
    o User control of "errpreset" and "relref" in transient analysis
    o Support for slotline and suspended stripline substrates
 - Eye analysis:
    o Support for crosstalk analysis
       - bit pattern setup per source
       - UI, delay, per source.
       - control over num UI per step response
    o Receiver jitter analysis - post processing bathtub curves with PDF's
    o Receiver noise analysis
    o Peak distortion analysis (worst case bit patterns)
    o Support for 8b10b encoding
 - New components:
    o Coplanar Waveguide
       - Air Bridge
       - Air Bridge, Cross Over
       - Bend, Ground Plane Distance
       - Tapered line, Exponential
       - Tapered Line, Linear
    o Grounded Coplanar Waveguide
       - Air Bridge
       - Air Bridge, Cross Over
       - Bend, Ground Plane Distance
       - Tapered Line, Exponential
       - Tapered Line, Linear
    o Microstrip
       - Air Bridge
       - Optimally Mitered Bend
       - Arbitrary Mitered Bend
       - Bond Pad
       - Differential Lines, Field Solver (1, 2, 3, 4, and 5 pairs)
       - Transmission Line, Field Solver
    o Stripline
       - Optimally Mitered Bend
       - Differential Lines, Field Solver (1, 2, 3, 4, and 5 pairs)
       - Transmission Line, Field Solver
    o Suspended Stripline
       - Transmission Line, Physical Length
       - Transmission Line, Electrical Length
    o Slotline
       - Multicoupled Lines (2, 3, and 4)
    o Filters
       - Bessel-Thompson Bandpass
       - Bessel-Thompson Bandreject
       - Bessel-Thompson Highpass
       - Bessel-Thompson Lowpass
       - Elliptic Bandpass
       - Elliptic Bandreject
       - Elliptic Highpass
       - Elliptic Lowpass
       - Pole-Zero Bandpass
       - Pole-Zero Bandreject
       - Pole-Zero Highpass
       - Pole-Zero Lowpass
       - Polynomial Bandpass
       - Polynomial Bandreject
       - Polynomial Highpass
       - Polynomial Lowpass
       - S-Domain Transfer Function, Pole-Zero
       - S-Domain Transfer Function, Polynomial
    o Ideal Microwave
       - Antenna, Dipole   
       - Antenna, Monopole
       - Microwave Link
    o Lumped General
       - Air Bridge, Rectangular Cross Section
       - Admittance Inverter
       - Impedance Inverter

Siwave 4.0即将发布：

SIwave v4.0 Enhancements:

Updated user interface
    - Improved layer stackup: ability to view vias on a layer by layer basis
    - Dynamic Zoom capability
    - Net Color mode
    - Editable Properties window
    - Find component based on Part Name or Reference Designator
    - Updated Reporter

Import/Export
    - BoardStation XE/RE import capability
    - Expedition v2007.x import capability
    - Layer stackup import and export
    - Apache CPM import
    - Component mapping file import (defines a partname as a specific type of component)
   
Project setup   
    - Package on PCB utility built into SIwave GUI   
    - Ability to modify trace cross sections (trapezoidal or hexagonal)
    - Updated validation check
    - Improved scripting capabilities
    - Sketched and Low bondwire models are available
    - User can define an IC Die Network

Meshing
    - New mesh generation approach (geomproc instead of bsm_mesh). New tolerance meshing
    - Improved adaptive mesh refinment for DC solver using energy error indicators
    - Adaptive near field observation mesh

Solver
    - Multilayer MoM2D solver (improved trace models)
    - Multithreaded trace extraction
    - Trace bend modeling
    - Coplane and split plane coupling and the ability to view coupled segments after the simulation completes
    - New via model for improved accuracy
    - 64-bit eigen solver
    - DC IR drop solver improvements
        Resistance probe
        Port solve and Spice Net List solve using the DC solver
        Be able to view convergence analysis like in HFSS and Q3D Extractor
    - Far field and near field calculation updates
    - SIwizard for Designer/Nexxim link
    - Ability to run multiple solutions and access the results
    - New thin metal plane handling (solver will treat them as traces).

随着siwave 4.0的发布，maxwell控制面板将彻底消失。

winworm

一个令人震惊的消息，Agilent EEsof面临调整，这金融危机搞得，ADS将何去何从？

Agilent's EEsof EDA Division, who claims to be the #5 EDA Vendor, no longer
exists, at least not as a separate division within Agilent Technologies.

There were massive layoffs at the Westlake Village, CA R&D center (former
EEsof facility) as well as layoffs in Santa Rosa and elimination of many
PDK development jobs in India.  In total there were approx 67 layoffs, out
of roughly 200 people in the former "division".  Job cuts included all
technical support, marketing, consulting services, and business admin in
Westlake Village.

What's left of EEsof has been collapsed into the Component Test Group.

ding3211

EESOF都要调整了？危机还要闹多久呢？真是可惜了。

jerryaaa

可惜了。

winworm

终于有了ADS 2009 Update1的消息，看来应该会继续，好事情。当形式不好的时候，大家的日子都不好过，都在一个产业链上。

Update1主要的增强在X参数，3D EM上，其中3D EM可能是与EMPro 2009提供集成接口。EMDS已经好久没有更新，我估计可能要调整，现在已经证实，EMPro 2009=AMDS+EMDS，包含FDTD，FEM两个全波电磁场引擎。


Advanced Design System (ADS) 2009 Update 1 includes:

    * New X-parameter Model Generator — creates fast, IP-protected nonlinear models
    * Enhanced Integrated 3D EM Analysis — including Finite Element EM sweeps, optimization and co-simulation with circuit analysis
    * Complete Flow to Manufacturing — including enhanced PDKs, interactive desktop design checker and Calibre LVS integration
    * New Optimization Cockpit — interactively monitor, tune and guide optimizations for better results, faster
    * Dozens of other improvements to the circuit & EM simulators, models & libraries, and the ADS Core platform including layout & data display



ADS 2009 Update 1 delivers new features and improved value for all ADS users with special focus on MMIC and RF Module design, including enhancing the complete flow to manufacturing. These new features eliminate the time to integrate disparate point tools from numerous vendors (e.g. 3D EM and Layout). This, along with the new simplified ADS product structure, can provide significant license cost savings for the MMIC/Module design. Learn more about the new ADS product structure.
New X-parameter Model Generator

X-parameter* models are fast, cascadable, nonlinear behavioral models that accurately account for frequency mixing and impedance mismatch. X-parameters fulfill a long standing need from the high-frequency design community for nonlinear behavioral models that can be created from measurement or simulation with the same speed and convenience as the well known linear S-parameters. The X-parameter Model Generator enables MMIC, RF-SIP and RF module design houses to provide their customers with an accurate, pre-prototype model of their nonlinear devices (e.g. power amplifiers, front-end modules and transceivers) to further enable concurrent design and secure early design wins. Learn more about X-parameters.
Enhanced Integrated 3D EM Analysis

3D parameterized components from Electromagnetic Professional (EMPro) can now be used for swept simulation and optimization in the ADS Finite Element simulator (EMDS G2). Custom parameterized 3D components can be created in EMPro’s solid modeling environment and then placed in ADS layout. EMDS G2 can then simulate the 3D component together with the surrounding layout and even co-simulate with ADS circuit simulators. This powerful combination will detect chip/module/package/board interface issues much earlier in the design process. Learn more about EMPro.
Complete Flow to Manufacturing

    * Enhanced and customized GaAs foundry qualified, approved and supported Process Design Kits (PDKs) that include Calibre & Assura DRC support and new MMIC toolbars
    * MMIC toolbars enable the full set of layout editing commands customized for foundry-specific PDKs, including single-button commands to: convert traces to transmission-line elements; edit transmission-line elements (stretch, tap, split, move to layer); automatically insert vias; automatically create multi-layer metal traces; synchronize layout back to the schematic; check design differences between layout and schematic; show nodal and physical connectivity; and launch the 3D layout viewer and DRC engine
    * Multi-technology PDK support provides easier management of interconnect layers and automation of MMIC/Module assembly for 3D EM simulation
    * iLVS, a new, interactive, desktop design checker that requires no setup and catches errors early in the design cycle
    * Calibre LVS integration supplements existing support for Calibre & Assura DRC

Learn more about Agilent EEsof EDA Foundry Partners and Industry Resources.
New Optimization Cockpit

The optimization cockpit is a new interactive environment (cockpit) that enables you to enter multiple optimization variables and goals and interactively tune and control the progress of the optimizer. This enables you to achieve the best performance while gaining design insights on the behavior of the optimized variables versus the goals. At a glance, you can identify which variables are constrained at the limits of their allowed ranges and adjust these limits to allow the optimizer to achieve better results. You can also observe the Pareto of which goals dominate the error function to provide guidance on setting the goal weightings.
When Will ADS 2009 Update 1 Be Available?

ADS 2009 Update 1 will be demonstrated at public events and tradeshows worldwide beginning with the MTT-S International Microwave Symposium (IMS) in Boston the week of June 9th. For more detail on IMS 2009, refer to the IMS 2009: Technical Program and Workshops.

Software for customer evaluation will be available after the ADS 2009 Update 1 Early Access/Beta program which will begin in June of 2009. Product shipments are expected by the end of the summer.

winworm

Ansoft与Ansys的产品整合终于进入尾声，Ansoft成为Ansys的EDA分部，Ansoft的产品基本上还是独立开发，发布也步入正轨，目前在HFSS11.2，Maxwell12.2上提供与Ansys 12的接口，与Ansys产品有重叠的是ePhysics，不知道是否会整合。另外，Ansoft网站终于在上月恢复更新，并以全新的面貌出现。

ding3211

版主，请问HFSS支持FDTD吗？

winworm

HFSS不支持FDTD，只有FEM。

winworm

New in SIwave v4.0

• Enhanced graphical user interface that allows simultaneous analyses and dynamic zooming
• Smart coupling algorithms with an advanced via solver combined with non-uniform (hexagonal and trapezoidal) trace cross-sections that provide accurate solutions beyond 10 Gb/s
• New co-planar algorithm within the solver extends accuracy for difficult package designs
• Ability to calculate trace characteristics on the fly
• Enhanced near- and far-field solvers for electromagnetic interference and compatibility problems
• Automated error checking and geometry correction
• Automated schematic creation, transient and QuickEye? analyses setup for circuit simulation driven by electromagnetics when using SIwave with Ansoft Designer.
• Auto- port creation for Apache RedHawk chip power modules
• Ability to link SIwave and ANSYS? Icepak? software to characterize heating due to copper-resistive losses

winworm

About HFSS 12

Meshing:
- TAU mesher
- 64-bit meshing
- Curvilinear mesh elements

Solve:
- Domain decomposition
- Analytical derivatives
- Mixed-order solutions
- Matched terminal port solutions
- Extended precision for port solutions

Remote Simulation:
- New remote simulation manager

Excitation Setup:
- Enhanced analytical polarization of modes
- Mode filtering for report setup

Desktop:
- Project preview
- Integrated crash reporting
- Hotkey customization

Modeler:
- ACIS 19 SP2
- Select by area
- Flexible history editing
- Defineable width for polyline cross-section
- Moveable sheet edges
- View model sections
- Wrap sheet around a solid
- 2D fillets and chamfers
- Imprint sheet on solid
- Enhanced healing: stitch and merge faces

Post-Processing:
- Post processing variables
- Expression cache for solve setup
- Report display types: stacked plots, rectangular contour plots, enhanced data tables
- Streamline field plots