Power Distribution Network Design Methodologies by Istvan Novak (Author) # Paperback: 544 pages # Publisher: International Engineering Consortium (May 5, 2008) # Language: English # ISBN-10: 1931695652 # ISBN-13: 978-1931695657 # Product Dimensions: 8.9 x 6 x 1.2 inches This book is the most complete, most thorough book that I have ever seen on the rapidly evolving field of power integrity (PI), which includes contributions from nearly 50 noted experts at well-known electronics manufacturers, consultants, and universities. Instead of presenting the one best solution, it offers a variety of viewpoints and discusses the complexity of building products, product cost, and their robustness against design and manufacturing errors. --John Barnes, Owner, dBi Corporation Dr. Istvan Novak has brought together industry experts of signal integrity and EMI to share their perspectives on power delivery design and experiences in optimizing the design of the power distribution network. This book covers the collected wisdom of the industry as reported over the last 10 years. If your work involves the power delivery network, this is a must-have. --Eric Bogatin, President, Bogatin Enterprises, LLC A comprehensive book on power distribution networks (PDN) and power integrity (PI) has been in need for some time, and this monumental volume by Dr. Novák is one of the best on this subject. This book brings tremendous and tangible value to anyone who has the interests in, or is already working on, these ever-evolving and intriguing fields. --Mike Peng Li, Principal Architect and Distinguished Engineer, Altera Corporation Product Description Power Distribution Network Design Methodologies is a collection of cogently written articles by 49 industry experts that fills in the void on PDN design procedures, and addresses among others such related topics as DC-DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, synthesis of impedance rofile. Through each of these contributions from such leading companies as SUN Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, the reader can come to understand why books on power-integrity are only now becoming available to the public and can relate these topics to current industry trends. Power Distribution Network Design Methodologies is a collection of cogently written articles by 49 industry experts that fills in the void on PDN design procedures, and addresses among others such related topics as DC-DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, synthesis of impedance profile. Through each of these contributions from such leading companies as SUN Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, the reader can come to understand why books on power-integrity are only now becoming available to the public and can relate these topics to current industry trends. About the Author Istvan Novak is a distinguished engineer of signal and power integrity at Sun Microsystems. He is a fellow of IEEE for his contributions to signal-integrity modeling, measurements, and simulations. Dr. Novak has been working on high-speed signaling and power distribution designs of Sun's V880, V480, V890, V490, T1000, T2000, T5120 and T5220 mid-range server families. His new technology development work with laminate suppliers, printed-circuit fabricators and component vendors resulted in the introduction of the first sub 2-mil laminates and controlled-ESR bypass capacitors for Sun servers. Dr. Novak developed a new validation methodology for the measurement of a wide range of power-distribution components, such as DC-DC converters, bypass capacitors and printed-circuit-board power-ground laminates. The methodology has been presented in several conference papers, two of which won the best paper awards. Dr. Novak carries 24 years of international consulting and instructing experience, and 28 years of design experience in the field of high-speed and high-frequency circuits and systems. He is an international consultant and instructor with 30 years of experience in the field of high-speed and high-frequency circuits and systems. Dr. Novak holds 25 patents in power distribution, signal integrity, and digital signal processing, is the co-author of "Frequency-Domain Characterization of Power Distribution Networks," and he has published more than 100 technical papers. Dr. Novak has worked and consulted for several companies in the computer and telecommunications industry, to do clock- and power-distribution networks, switching-mode converters as well as various high-speed backplanes, PCI buses, and copper and optical interconnects in the GB/s range. Dr. Novak obtained his Ph.D. degree from the Hungarian Academy of Sciences, and he received his technical education from the Technical University of Budapest. Part I Chapter 1: Power Supply Compensation for Capacitive Loads Jonathan L. Fasig, Principal Engineer, Mayo Clinic Barry K. Gilbert, Director, Mayo Clinic Erik S. Daniel, Deputy Director, Mayo Clinic 1.1: Abstract 1.2: Introduction 1.3: System Overview 1.4: Power Supply Stability Primer 1.5: Analysis 1.6: Conclusion Chapter 2: DC-DC Converters: What is Wrong with Them? Istvan Novak, Senior Signal Integrity Staff Engineer, Sun Microsystems 2.1: Abstract 2.2: Introduction 2.3: DC-DC Converter Parameters Related to Signal Integrity 2.4: Potential SI Problems from the User's Perspective 2.5: Conclusion Chapter 3: The Advantage of Controlled-ESR Polymer Capacitators Hideki Ishida, Design and Application Section Manager, Sanyo Electric Co. 3.1: Abstract 3.2: Controlling ESR Value of Tantalum Polymer Capacitor 3.3: Importance of Controlled ESR Value Capacitor 3.4: Tantalum Polymer Capacitor with DC/DC Converter Switching in the MHz Range 3.5: Equivalent Circuit of Polymer Tantalum Capacitor Chaper 4: ESR-Controlled MLCCs and Decoupling Capacitor Network Design Masaaki Togashi, Senior Development Engineer, TDK Corp. Chris Burket, Senior Applications Engineer, TDK Corp. 4.1: Abstract 4.2: Introduction 4.3: Decoupling Capacitor Network 4.4: ESR and ESL 4.5: ESR Control Method 4.6: ESR/ESL Measurement of MLCCs 4.7: Measurement Results 4.8: Circuit Analysis using SPICE Simulation 4.9: Lower ESL Development 4.10: Conclusion Part II Chapter 5: A Power Distribution System K. Barry A. Williams, Principal Engineer, Hewlett-Packard 5.1: Abstract 5.2: An Example of a Power Distribution Design System 5.3: The Problem Schematic 5.4: The Characterization of the Load 5.5: System Bandwidth 5.6: Determination of the Maximum Impedance 5.7: The Q of the System 5.8: Capacitance and Inductance Determination 5.9: Resonant Frequency Points 5.10: Number of Capacitors 5.11: Summary of Compiled Results 5.12: Summary of the Capacitor Selections and Graphical Selections 5.13: Graphics Results with Added Resistance 5.14: Sensitivity 5.15: Summary of the Design Chapter 6: Designing Minimum Cost VRM8.2/8.3 Compliant Converters Richard Redl, President, ELFI S.A. Brian Erisman, Project Engineer, Analog Devices, Inc. 6.1: Abstract 6.2: Introduction 6.3: Objective Specifications 6.4: Load Transient Performance Limits of the Buck Converter 6.5: Optimal Load Transient Response 6.6: Commonly Used Control Techniques 6.7: Design for Optimal Output Impedance 6.8: Computer Simulations and Experimental Results 6.9: Summary Chapter 7: Frequency Domain Target Impedence Method for Bypass Capacitator Selection for Power Distribution Systems Larry D. Smith, Principal Signal Integrity Engineer, Altena Corp. 7.1: Abstract 7.2: Introduction 7.3: Target Impedance 7.4: Impedance in the Frequency Domain 7.5: PCB Bypass Capacitor 7.6: Capacitor Sizing from Target Impedance and Corner Frequency 7.7: ESR Considerations 7.8: Problems at High and Low Frequency 7.9: Comparing FDTIM to Other Methods 7.10: Conclusion Chapter 8: Resonant-Free Power Network Design Using Extended Adaptive Voltage Positioning Methodology Alex Waizman, Principal Engineer, Intel Corp. Chee-Yee Chung, Principal Engineer, Intel Corp. 8.1: Abstract 8.2: Introduction 8.3: Lumped Power Delivery Model 8.4: Adaptive Voltage Positioning 8.5: EAVP 8.6: Time Domain Results 8.7: Future Work 8.8: Summary Chapter 9: Distributed Matched Bypassing for Board-Level Power Distribution Networks Istvan Novak, Senior Staff Engineer, Sun Microsystems Leesa Noujeim, Staff Engineer, Sun Microsystems Valerie St. Cyr, Supply Base Development Manager, Sun Microsystems Nick Biunno, Principal Engineer, Sanmina-SCI Atul Patel, Process Engineer, Sanmina-SCI George Korony, Senior Member of Technical Staff, AVX Corp. Andy Ritter, Senior Member of Technical Staff, AVX Corp. 9.1: Abstract 9.2: Introduction 9.3: Distributed Matched Bypassing of Power Distribution Networks 9.4: Implementation of Distributed Matched Bypassing 9.5: The Concept of the Bypass Resistor 9.6: Conclusion Part III Chapter 10: Comparison of Power Distribution Network Design Methods: An Approach to System-Level Power Distribution Analysis Dale Becker, Senior Technical Staff Member, IBM Corp. 10.1: Abstract 10.2: Introduction 10.3: A Computer System 10.4: Power Distribution Noise Analysis 10.5: Summary Chapter 11: Bypass Filter Design Considerations for Modern Digital Systems, a Comparative Evaluation of the Big "V," Multipole, and Many Pole Bypass Strategies Steve Weir, Consultant, Teraspeed Consultant Group 11.1: Abstract 11.2: What Does the Bypass Network Do? 11.3: Multilayer Chip Capacitor Bypass Basics 11.4: Bypass Strategies--Three Methods, Three Faiths? 11.5: Summary 11.6: Conclusion Chapter 12: Comparison of Power Distribution Network Design Methods: Bypass Capacitator Selection Based on Time Domain and Frequency Domain Preferences Istvan Novak, Senior Signal Integrity Staff Engineer, Sun Microsystems 12.1: Abstract 12.2: Introduction 12.3: So, What Is the Metric? 12.4: Comparison of Popular Methods Based on Lumped Self-Impedance 12.5: Component Placement 12.6: Implementation Examples 12.7: Conclusion Chapter 13: PDN Design Strategies: Ceramic SMT Decoupling Capacitators--What Values Should I Choose? James L. Knighten, Senior Staff Engineer, NCR Corp. Bruce Archambeault, Distinguished Engineer, IBM Jun Fan, Senior Hardware Engineer, NCR Corp. Giuseppe Selli, Ph.D. Candidate, University of Missouri-Rolla Samuel Connor, Senior Engineer, IBM James L. Drewniak, Professor, University of Missouri-Rolla 13.1: Introduction 13.2: The Power Bus Function 13.3: The Decoupling Capacitor 13.4: Interconnect Inductance 13.5: Conclusion Part IV Chapter 14: Power Integrity Analysis of DDR2 Memory Systems during Simultaneous Switching Events Ralf Schmitt, Signal Integrity Engineer, Rambus, Inc. Joong-Ho Kim, Signal Integrity Engineer, Rambus, Inc. Chuck Yuan, Signal Integrity Engineer, Rambus, Inc. June Feng, Signal Integrity Engineer, Rambus, Inc. Woopoung Kim, Signal Integrity Engineer, Rambus, Inc. Dan Oh, Signal Integrity Engineer, Rambus, Inc. 14.1: Abstract 14.2: Introduction 14.3: Supply Noise Modeling Methodology for Interface Systems 14.4: SSN Model for DDR2 Test System 14.5: Determining Worst-Case Switching Profiles 14.6: Correlating Supply Noise Parameters 14.7: Measuring Supply Noise on Internal Supply Voltage 14.8: Summary Chapter 15: Analysis of Supply Noise Induced Jitter in Gigabit I/O Interfaces Ralf Schmitt, Signal Integrity Engineers, Rambus, Inc. Hai Lan, Signal Integrity Engineer, Rambus, Inc. Chris Madden, Signal Integrity Engineer, Rambus, Inc. Chuck Yuan, Signal Integrity Engineer, Rambus, Inc. 15.1: Abstract 15.2: Introduction 15.3: Power Supply Design Environment Requirements for Gigabit I/O Interfaces 15.4: Overview of Gigabit I/O Interface Test System 15.5: Measurement of Supply Noiseâ |