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发表于 2008-12-30 08:58:00
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2008年即将过去，忙碌的一年，多事的一年，期待一下2009吧！
2009将有2本si book出版，都是进阶版本：
Advanced Signal Integrity for High-Speed Digital Designs (Hardcover)
by Stephen H. Hall (Author), Howard L. Heck (Author)
这本书的出版日期一再延后，现在应该不会再跳票了吧，最初只有300多页，到现在膨胀到600多页，将近翻倍，这也从另一个侧面说明si发展迅速，以至于book的内容更新还跟不上，新的内容集中在后半部分，主要是关于高速串行互连设计的，而我想看到的也正是这部分。
Editorial Reviews
Product Description
Signal integrity has become the key issue in most high-performance digital designs. Now, from the foremost experts in the field, this book leverages theory and techniques from non-related fields such as applied physics, communications, and microwave engineering and applies them to the field of high-speed digital design. This approach creates an optimal combination of theory and practice that is meaningful to practicing engineers and graduate students alike.
Product Details
* Hardcover: 682 pages
* Publisher: Wiley-IEEE Press (March 23, 2009)
* Language: English
* ISBN-10: 0470192356
* ISBN-13: 978-0470192351
Stephen Hall, Intel Corporation
Stephen Hall began his career in 1992 in the Special Purpose Processor Division of the Mayo Foundation developing multi-gigabit modeling techniques for X-band digital radar and serial optical links. In 1996, Stephen accepted a job at Intel, where he was lead designer for buses on Pentium? II, III, and IV systems, coordinated research with universities, led research teams in the area of high-speed modeling, and taught Signal Integrity courses. In 2000, Stephen published the textbook "High-Speed Digital System Design" through John Wiley & Sons and is currently co-authoring a new book, "Advanced Signal Integrity for High-Speed Digital Designs," which will be published in the fall of 2008. From 2003 to 2007, Stephen primarily researched new modeling and measurement solutions for channel speeds as high as 30 Gigabits per second and is currently leading PCIe3 channel development at Intel.
Howard Heck, Intel Corporation
Since joining Intel in 1995, Howard has held R&D engineering and management positions for system electrical technologies (interconnect, power, EMI). He led the development team for the Pentium? II 100 MHz Host Bus, earning an Intel Achievement Award, and managed teams that defined and delivered technology solutions for Direct RDRAM?, DDR II, Pentium? 4 Processor Host Bus, and Accelerated Graphics Port (AGP) interfaces. Prior to joining DEG, he led the Advanced Signaling Technologies team in Intel's Systems Technology Lab, focusing on modeling, simulation, measurement, and technology solution development for 10+ Gb/s signaling. He currently leads the signal integrity effort for Larrabee and Larrabee II. Howard earned the B.S.Ch.E. degree from Northwestern University in 1985, and the M.S.E.E. degree from the National Technological University in 1994. From 1985-1995 he was employed by IBM's printed circuit board manufacturing and high-performance packaging lab, where he led electrical development of their HyperBGA? packaging technology. Since 1997, Howard has also held a position as an Adjunct Professor at the Oregon Graduate Institute, where he teaches High-Speed Digital Interconnect Design. He has presented papers at several industry conferences, holds six patents with four pending, and is a Senior Member of the IEEE.
Preface.
Acknowledgments.
Chapter 1: Introduction: The importance of signal integrity.
1.1 Computing Power: Past and Future.
1.2 The problem.
1.3 The Basics.
1.4 A new realm of bus design.
1.5 Scope.
1.6 Summary.
1.7 References.
Chapter 2: Electromagnetic Fundamentals for Signal Integrity.
2.1 Introduction.
2.2 Maxwell’s Equations.
2.3 Common Vector Operators.
2.4 Wave Propagation.
2.5 Electrostatics.
2.6 Magnetostatics.
2.7 Power Flow and the Poynting Vector.
2.8 Reflections of Electromagnetic Waves.
2.9 References.
2.10 Problems.
Chapter 3: Ideal Transmission Line Fundamentals.
3.1 Transmission Line Structures.
3.2 Wave propagation on loss free transmission lines.
3.3 Transmission line properties.
3.4 Transmission line parameters for the loss free case.
3.5 Transmission line reflections.
3.6 Time domain Reflectometry.
3.7 References.
3.8 Problems.
Chapter 4: Crosstalk.
4.1 Mutual Inductance and Capacitance.
4.2 Coupled Wave Equations.
4.3 Coupled Line Analysis.
4.4 Modal Analysis.
4.5 Crosstalk Minimization.
4.6 Summary.
4.7 References.
4.8 Problems.
Chapter 5: Non-ideal conductor models for transmission lines.
5.1 Signals propagating in an unbounded conductive media.
5.2 Classic conductor model for transmission lines.
5.3 Surface Roughness.
5.4 Transmission line parameters with a non-ideal conductor.
5.5 Problems.
Chapter 6: Electrical properties of dielectrics.
6.1 Polarization of dielectrics.
6.2 Classification of dielectric materials.
6.3 Frequency dependent dielectric behavior.
6.4 Properties of a physical dielectric model.
6.5 The fiber-weave effect.
6.6 Environmental variation in dielectric behavior.
6.7 Transmission line parameters for lossy dielectrics and realistic conductors.
6.8 References.
6.9 Problems.
Chapter 7: Differential signaling.
7.1 Removal of common mode noise.
7.2 Differential Crosstalk.
7.3 Virtual reference plane.
7.4 Propagation of Modal Voltages.
7.5 Common terminology.
7.6 Drawbacks of differential signaling.
7.7 References.
7.8 Problems.
Chapter 8: Mathematical Requirements of Physical Channels.
8.1 Frequency domain effects in time domain simulations.
8.2 Requirements for a physical Channel.
8.3 References.
8.4 Problems.
Chapter 9: Network Analysis for Digital Engineers.
9.1 High frequency voltage and current waves.
9.2 Network Theory.
9.3 Properties of Physical S-parameters.
9.4 References.
9.5 Problems.
Chapter 10: Topics in High-Speed Channel Modeling.
10.1 Creating a physical transmission line mode.
10.2 Non-Ideal Return Paths.
10.3 Vias.
10.4 References.
10.5 Problems.
Chapter 11: I/O Circuits and Models.
11.1 Introduction.
11.2 Push-Pull Transmitters.
11.3 CMOS Receivers.
11.4 ESD Protection Circuits.
11.5 On-Chip Termination.
11.6 Bergeron Diagrams.
11.7 Open Drain Transmitters.
11.8 Differential Current Mode Transmitters.
11.9 Low Swing/Differential Receivers.
11.10 IBIS Models.
11.11 Summary.
11.12 References.
11.13 Problems.
Chapter 12: Equalization.
12.1 Introduction.
12.2 Continuous Time Linear Equalizers.
12.3 Discrete Linear Equalizers.
12.4 Decision Feedback Equalization.
12.5 Summary.
12.6 References.
12.7 Problems.
Chapter 13: Modeling and Budgeting of Timing Jitter and Noise.
13.1 The Eye Diagram.
13.2 Bit Error Rate.
13.3 Jitter Sources and Budgets.
13.4 Noise Sources and Budgets.
13.5 Peak Distortion Analysis Methods.
13.6 Summary.
13.7 References.
13.8 Problems.
Chapter 14: System Analysis Using Response Surface Modeling.
14.1 Introduction.
14.2 Case Study: 10 Gb/s differential PCB interface.
14.3 RSM Construction by Least Squares Fitting.
14.4 Measures of Fit.
14.5 Significance Testing.
14.6 Confidence Intervals.
14.7 Sensitivity Analysis and Design Optimization.
14.8 Defect Rate Prediction Using Monte Carlo Simulation.
14.9 Additional RSM Considerations.
14.10 Summary.
14.11 References.
14.12 Problems.
Appendix A: Useful formulae, identities, units and constants.
Appendix B: 4-port Conversions between T and S-parameters.
Appendix C: Critical values of the F-statistic.
Appendix D: Critical values of the t-statistic..
Appendix E: Derivation of the internal inductance using the Hilbert Transform.
Signal and Power Integrity - Simplified (2nd Edition) (Prentice Hall PTR Signal Integrity Library) (Hardcover)
这本书加入了Eric这几年在PI上的研究成果，估计会有20%左右的新内容，基本上也能猜测到里面的内容，Eric倡导的PI设计方法简单、实用，到时候大家可以收藏一本。
Editorial Reviews
Product Description
The #1 guide to signal integrity, updated with all-new coverage of power integrity, high-speed serial links, and more. - Up-to-the-minute comprehensive guidance: everything engineers need to know to understand and design for signal integrity - Authored by world-renowned signal integrity trainer, educator, and columnist Eric Bogatin - Focuses on intuitive understanding, practical tools, and engineering discipline - not theoretical derivation or mathematical rigor Summary Today's marketplace demands faster devices and systems that deliver more functionality and longer life in smaller packaging. Signal Integrity - Simplified, Second Edition is the first book to bring together all the up-to-the-minute techniques designers need to overcome all of those challenges. Renowned expert Eric Bogatin thoroughly reviews the root causes of all four families of signal integrity problems, and shows how to design them out early in the design cycle. Drawing on his experience teaching 5,000+ engineers, he illuminates signal integrity, physical design, bandwidth, inductance, and impedance; presents practical tools for solving signal integrity problems; and offers specific design guidelines and solutions. In this edition, Bogatin adds extensive coverage of power integrity and high speed serial links: topics at the forefront of signal integrity design. Three new chapters address: " Designing power delivery networks to support high-speed signal processing " Using 4-Port S-parameters, the emerging standard for describing interconnects in high speed serial links " Working with today's measurement and simulation tools and technologies
About the Author
Eric Bogatin is President of Bogatin Enterprises, a top provider of signal integrity training and education. His web site, BeTheSignal.com, provides 100+ free publications and 50+ hours of streaming video lectures. Active in signal integrity and interconnect design for 26 years, he has taught 5,000+ engineers through public short courses, in-house short courses at companies such as LSI Logic, Intel, Cisco and IBM, and graduate-level courses as an Adjunct Professor at San Jose State and UC Berkeley Extension.
Product Details
* Hardcover: 730 pages
* Publisher: Prentice Hall PTR; 2 edition (June 8, 2009)
* Language: English
* ISBN-10: 0132349795
* ISBN-13: 978-0132349796
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发表于 2008-10-8 15:59:00