IPC-A-600E 中英文对照 一.
外观特性(Externally Observable Characteristics) 1.
板边(Board edges) 1.1
毛刺 (Burrs) 1.2
缺口 (Nicks) 1.3
晕圈 (Haloing) 2.
基材的表面与次表面 (Base Material Surface and Subsurface) 2.1
露织物/显布纹 (Weave Exposure/Texture Conditions) 2.2
麻点和微空洞 (Pits and Micro voids) 3.
基材的次表面 (Base Material Subsurface) 3.1
白斑/龟裂 (Measling/Crazing) 3.2
分层/起泡 (Delamination/Blister) 3.3
外来夹杂物 (Foreign Inclusions) 4.
焊料涂覆层和熔融锡铅层 (Solder Coatings and Fused Tin Lead) 4.1
不润湿 (No wetting) 4.2
半润湿 (De wetting) 5.
镀通孔 (Holes-Plated Through) 5.1
结瘤/毛刺 (Nodules/Burrs) 5.2
粉红圈 (Pink Ring) 5.3
铜镀层空洞 (Plating Voids- Copper Plating) 5.4
成品镀覆层的镀层空洞 (Plating Voids – Finished Coating) 6.
非支撑孔 (Holes Unsupported) 6.1
晕圈 (Haloing) 7. 印制插头 (Printed Contacts) 7.1
表面镀层概况 (Surface Plating – General) 7.2
板边插头的毛刺 (Burrs on Edge-Board Contacts) 7.3
表面镀层的附着力 (Adhesion of Over plate) 8.
标记 (Marking) 9.
阻焊剂(阻焊) (Solder Resist
or Solder Mask) 9.1
导线表面的涂覆层 (Coverage Over Conductors) 9.2
对焊盘的重合度 (Registration to Lands) 9.3
镀通孔焊盘以外其它图形的重合度 (Registration to Features other than PTH Lands) 9.4
起泡/分层 (Blisters/Delamination) 9.5
附着力(剥落或起皮) Adhesion (Flaking or Peeling) 9.6
涂层漏印 (Skip Coverage) 9.7
波纹/皱褶/皱纹 (Waves/Wrinkles/Ripples) 9.8
掩孔(导通孔) Tenting (Via Holes) 9.9
吸管式空隙 (Soda Strawing) 9.10
厚度 (Thickness) 10.
尺寸特性 (Dimensional Characteristics) 10.1
导线宽度和间距 (Conductor Width and Spacing) 10.2
孔环的测量 (Annular Ring – Measurement) 10.3
支撑孔的孔环 (Annular Ring – Supported Holes) 10.4
非支撑孔的孔环 (Annular Ring – Unsupported Holes) 10.5
不规则形状焊盘的孔环(Annular Ring – Irregular Shaped Lands) 10.6
平整度 (Flatness)Layers) |