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IPC-1066
Marking, Symbols and Labels
for Identification of Lead-Free
and Other Reportable Materials
in Lead-Free Assemblies,
Components and Devices
Table of Contents
1 SCOPE ...................................................................... 1
2 APPLICABLE DOCUMENTS ................................... 1
3 TERMS AND DEFINITIONS ..................................... 1
3.1 2nd Level Interconnect .......................................... 1
3.2 2nd Level Interconnect Label ................................ 1
3.3 Bar Code Label ..................................................... 1
3.4 RoHS ..................................................................... 1
3.5 Halogen-Free ......................................................... 1
3.6 Pb-Free (Lead-Free) .............................................. 1
3.7 Pb-Free Category .................................................. 1
3.8 Pb-Free Identification Label ................................. 1
3.9 Pb-Free Symbol .................................................... 1
4 LABELS AND SYMBOLS ........................................ 2
5 LABELING CATEGORIES ....................................... 3
5.1 Solder Finish Categories ....................................... 3
5.2 Resin Category ...................................................... 3
5.3 Conformal Coating Categories ............................. 3
6 COMPONENT MARKING ......................................... 3
6.1 Size ........................................................................ 3
6.2 Color ...................................................................... 3
6.3 Font ........................................................................ 3
6.4 Maximum Safe Assembly Temperature ............... 3
7 PRINTED CIRCUIT BOARD/
ASSEMBLY MARKING ............................................. 3
7.1 Category Hierarchy ............................................... 3
7.2 Location ................................................................. 3
7.3 Color ...................................................................... 3
7.4 Size ........................................................................ 3
7.5 Method .................................................................. 3
7.6 Marking Sequence ................................................ 3
7.7 Repair Marking ..................................................... 3
8 SYMBOL AND LABELS ........................................... 4
8.1 Pb-Free Symbol .................................................... 4
8.2 Pb-Free Identification Label ................................. 4
8.2.1 Size ........................................................................ 4
8.2.2 Color ...................................................................... 4
8.3 2nd Level Interconnect Label ................................ 4
8.3.1 Components ........................................................... 4
8.3.2 Assemblies ............................................................ 4
8.3.3 Size ........................................................................ 4
8.3.4 Color ...................................................................... 4
IPC-1066-2004 字符、无铅标识接收标准.pdf |
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发表于 2011-1-13 14:47:43
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