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1. 附件：attached 2. 样品：sample 3. 承认：approval 4. 答复：answer;reply 5. 规格：spec 6. 与...同样的：the same as 7. 前版本：previous version(old version) 8. 生产：production 9. 确认：confirm 10. 再次确认：doubleconfirm 11. 工程问题：engineering query（EQ） 12. 尽快：ASAP(as soon as possible) 13. 生产文件：production gerber 14. 联系某人：contact somebody 15. 提交样板：submit sample 16. 交货期：delivery date 17. 电测成本：ET（electrical test） cost 18. 通断测试：Open and shorttesting 19. 参考：refer to 20. IPC标准：IPC standard 21. IPC二级：IPC class 2 22. 可接受的：acceptable 23. 允许：permit 24. 制造：manufacture 25. 修改：revision 26. 公差：tolerance 27. 忽略：ignore(omit) 28. 工具孔：toolinghole 29. 安装孔：mountinghole 30. 元件孔：componenthole 31. 槽孔：slot 32. 邮票孔：snapoff hole 33. 导通孔：via 34. 盲孔：blind via 35. 埋孔：buriedvia 36. 金属化孔：PTH(platingthrough hole) 37. 非金属化孔：NPTH(no plating through hole) 38. 孔位：holelocation 39. 避免：avoid 40. 原设计：originaldesign 41. 修改：modify 42. 按原设计：leaveit as it is 43. 附边：wastetab 44. 铜条：copperstrip 45. 拼板强度：panelstrong 46. 板厚：boardthickness 47. 删除：remove(delete) 48. 削铜：shavethe copper 49. 露铜：copperexposure 50. 光标点：fiducialmark 51. 不同：bedifferent from(differ from) 52. 内弧：insideradius 53. 焊环：annularring 54. 单板尺寸：singlesize 55. 拼板尺寸：panelsize 56. 铣：routing 57. 铣刀：router 58. V-cut：scoring 59. 哑光：matt 60. 光亮的：glossy 61. 锡珠：solderball(solder plugs) 62. 阻焊：soldermask(solder resist) 63. 阻焊开窗：soldermask opening 64. 单面开窗：singleside mask opening 65. 补油：touchup solder mask 66. 补线：trackwelds 67. 毛刺：burrs 68. 去毛刺：deburr 69. 镀层厚度：platingthickness 70. 清洁度：cleanliness 71. 离子污染：ioniccontamination 72. 阻燃性：flammabilityretardant 73. 黑化：blackoxidation 74. 棕化：brownoxidation 75. 红化：redoxidation 76. 可焊性：solderability 77. 焊料：solder 78. 包装：packaging 79. 角标：cornermark 80. 特性阻抗：characteristicimpedance 81. 正像：positive 82. 负片：negative 83. 镜像：mirror 84. 线宽：conductorwidth 85. 线距：conductorspacing 86. 做样：buildsample 87. 按照：as per 88. 成品：finished 89. 做变更：make the change 90. 相类似：similar to 91. 规格：specification 92. 下移：shiftdown 93. 垂直地：vertically 94. 水平的：horizontally 95. 增大：increase 96. 缩小：decrease 97. 表面处理：SurfaceFinishing 98. 波峰焊：wavesolder 99. 钻孔数据：drillingdate 100. 标记：Logo 101. Ul标记：Ul Marking 102. 蚀刻标记：etchedmarking 103. 周期：datecode 104. 翘曲：bowand twist 105. 外层：outerlayer 106. 内层：internallayer 107. 顶层：toplayer 108. 底层：bottomlayer 109. 元件面：componentside 110. 焊接面：solder side 111. 阻焊层：solder mask layer 112. 丝印层：legendlayer (silkscreen layer or over layer) 113. 兰胶层：peelableSM layer 114. 贴片层：pastemask layer 115. 碳油层：carbonlayer 116. 外形层：outlinelayer(profile layer) 117. 白油：whiteink 118. 绿油：greenink 119. 喷锡：hotair leveling (HAL) 120. 水金：flashgold 121. 插头镀金：platedgold edge-board contacts 122. 金手指：Gold-finger 123. 防氧化：Entek(OSP) 124. 沉金：Immersiongold (chem. Gold) 125. 沉锡：ImmersionTin(chem.Tin) 126. 沉银：ImmersionSilver (chem. silver) 127. 单面板：singlesided board 128. 双面板：doublesided board 129. 多层板：multilayerboard 130. 刚性板：rigidboard 131. 挠性板：flexibleboard 132. 刚挠板：flex-rigidboard 133. 铣：CNC(mill , routing) 134. 冲：punching 135. 倒角：beveling 136. 倒斜角：chamfer 137. 倒圆角：fillet 138. 尺寸：dimension 139. 材料：material 140. 介电常数：Dielectric constant 141. 菲林：film 142. 成像：Imaging 143. 板镀：PanelPlating 144. 图镀：PatternPlating 145. 后清洗：FinalCleaning 146. 叠层：layup(stack-up) 147. 污染焊盘：contaminatepad 148. 分孔图：drillchart 149. 度数：degree 150. 被…覆盖：be covered with 151. 负公差：minustolerance 152. 标靶盘：target pad 153. 外形公差：routingtolerance 154. 芯板：core
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发表于 2013-3-13 10:05:03
