IPC-4204 |
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
挠性金属箔去电应用于柔性电路组装
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IPC-6013-K |
Qualification & Performance Specification for Flexible Printed Boards & Amendment 1
挠性印制板的鉴定与性能规范(包括修改单1) |
IPC/JPCA-6202 |
IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
IPC/JPCA单双面挠性印制板性能手册 |
IPC-FA-251 |
Guidelines for Assembly of Single- and Double-Sided Flex Circuits
单面和双面挠性电路组装导则
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IPC-FC-234 |
Composite Metallic Materials Specification for Printed Wiring Boards
印制线路板复合金属材料规范
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IPC-MB-380 |
Guidelines for Molded Interconnection Devices 模压互连器件导则 |
IPC-M-107 |
Standards for Printed Board Materials Manual 印制板材料标准手册 |
IPC-MI-660 |
Incoming Inspection of Raw Materials Manual 原材料接收检验手册 |
IPC-4101A |
Specifications for Base Materials for Rigid and Multilayer Printed Boards
刚性及多层印制板用基材规范
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IPC-4121 |
Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则 |
IPC-4562 |
Metal Foil for Printed Wiring Applications
印制线路用金属箔 |
IPC-CF-148A |
Resin Coated Metal for Printed Boards
印制板用涂树脂金属箔 |
IPC-CF-152B |
Composite Metallic Materials Specification for Printed Wiring Boards
印制线路板复合金属材料规范
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IPC-TR-482 |
New Developments in Thin Copper Foils
薄铜箔的新发展 |
IPC-TR-484 |
Results of IPC Copper Foil Ductility Round Robin Study
IPC铜箔延展性联合研究结果 |
IPC-TR-485 |
Results of Copper Foil Rupture Strength Test Round Robin Study
铜箔断裂强度试验联合研究结果
|
IPC-4412 |
Specification for Finished Fabric Woven from ”E” Glass for Printed Boards
“E”类精纺玻璃纤维层印制板技术规范
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IPC-4130 |
Specification & Characterization Methods for Nonwoven "E" Glass Materials
E 玻璃纤维非织布材料规范及性能确定方法
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IPC-4110 |
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
印制板用纤维纸规范及性能确定方法 |
IPC-4411-K |
Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1
聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1 |
IPC-4411-AM1 |
Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1
关于聚芳基酰胺非织布规范及性能确定方法的修改单 1 |
IPC-SG-141 |
Specification for Finished Fabric Woven from "S" Glass for Printed Boards
印制板用经处理S玻璃纤维织物规范
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IPC-A-142 |
Specification for Finished Fabric Woven from Aramid for Printed Boards
印制板用经处理聚芳酰胺纤维编织物规范
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IPC-QF-143 |
Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
印制板用经处理石英(熔融纯氧化硅)纤维编织物规范 |
IPC-2524 |
PWB Fabrication Data Quality Rating System
印制板制造数据质量定级体系 |
IPC-9151A |
Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database
印制板工艺, 容量, 质量,可靠性试验标准和数据库 |
IPC-9191 |
General Guidelines for Implementation of Statistical Process Control (SPC)
实施统计过程控制(SPC)的通用导则
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IPC-9199 |
Statistical Process Control (SPC) Quality Rating
统计分析控制 |
IPC-9252 |
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
未组装印制板电测试要求和指南 |
IT-97061 |
PWB Hole to Land Misregistration: Causes and Reliability
印制线路板通孔与焊盘的错位: 原因和可靠性
|
IT-98103 |
Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels
多层板内部无焊盘层互连错位的可靠性 |
IPC-MS-810 |
Guidelines for High Volume Microsection
大批量显微剖切导则 |
IPC-QL-653A |
Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
印制板、元器件及材料检验试验设备的认证 |
IPC-TR-483 |
Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test
薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告
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IPC-TR-486 |
Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation
内层分离的互连应力测试(IST)与显微剖切相关性联合研究 |
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