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IPC技术标准目录之 印 制 电 路 板1

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发表于 2004-7-25 14:37:39 | 显示全部楼层 |阅读模式
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 楼主| 发表于 2004-7-25 14:38:21 | 显示全部楼层
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry 挠性金属箔去电应用于柔性电路组装
IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards & Amendment 1 挠性印制板的鉴定与性能规范(包括修改单1)
IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA单双面挠性印制板性能手册
IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits 单面和双面挠性电路组装导则
IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards 印制线路板复合金属材料规范
IPC-MB-380 Guidelines for Molded Interconnection Devices 模压互连器件导则
IPC-M-107 Standards for Printed Board Materials Manual 印制板材料标准手册
IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册
IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards 刚性及多层印制板用基材规范
IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则
IPC-4562 Metal Foil for Printed Wiring Applications 印制线路用金属箔
IPC-CF-148A Resin Coated Metal for Printed Boards 印制板用涂树脂金属箔
IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards 印制线路板复合金属材料规范
IPC-TR-482 New Developments in Thin Copper Foils 薄铜箔的新发展
IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin Study IPC铜箔延展性联合研究结果
IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study 铜箔断裂强度试验联合研究结果
IPC-4412 Specification for Finished Fabric Woven from ”E” Glass for Printed Boards “E”类精纺玻璃纤维层印制板技术规范
IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass Materials E 玻璃纤维非织布材料规范及性能确定方法
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards 印制板用纤维纸规范及性能确定方法
IPC-4411-K Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1 聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1
IPC-4411-AM1 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1 关于聚芳基酰胺非织布规范及性能确定方法的修改单 1
IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards 印制板用经处理S玻璃纤维织物规范
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards 印制板用经处理聚芳酰胺纤维编织物规范
IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用经处理石英(熔融纯氧化硅)纤维编织物规范
IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系
IPC-9151A Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database 印制板工艺, 容量, 质量,可靠性试验标准和数据库
IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计过程控制(SPC)的通用导则
IPC-9199 Statistical Process Control (SPC) Quality Rating 统计分析控制
IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南
IT-97061 PWB Hole to Land Misregistration: Causes and Reliability 印制线路板通孔与焊盘的错位: 原因和可靠性
IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性
IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则
IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证
IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test 薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告
IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 内层分离的互连应力测试(IST)与显微剖切相关性联合研究
更多内容,请浏览 http://www.ipc.org/onlinestore
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